Gubungela iglasi, vala ilensi ye-optical bonding
Iyaqhuba
Xa kuziwa kwi-optical bonding, ifuna i-warpage ephantsi phakathi kweglasi yokugubungela kunye nepaneli ye-LCD, nasiphi na isikhewu esingamkelekanga sokunyamezela siya kosulela i-bonding kunye ne-sensors epheleleyo.
Ukuqiniswa kwekhemikhali kunokulawula i-warpage yeglasi <0.2mm(thatha i-3mm umzekelo).
Ngelixa ubushushu bobushushu kuphela bunokuba <0.5mm (thatha i-3mm umzekelo).
Uxinzelelo oluphakathi: 450Mpa-650Mpa, eyenza iglasi ibe nokusebenza ngcono kwi-scratch resistant.
Idatha yoBugcisa
Iglasi ye-aluminosilicate | Iglasi ye-soda yekalika | |||||
Uhlobo | iglasi yegorila yecorning | iglasi yedragontrail | Schott Xensat | iglasi yepanda | Iglasi ye-NEG T2X-1 | iglasi edadayo |
Ukutyeba | 0.4mm, 0.5mm, 0.55mm, 0.7mm 1mm, 1.1mm, 1.5mm, 2mm | 0.55mm, 0.7mm, 0.8mm 1.0mm, 1.1mm, 2.0mm | 0.55mm, 0.7mm 1.1mm | 0.7mm, 1.1mm | 0.55mm, 0.7mm 1.1mm | 0.55mm, 0.7mm, 1.1mm, 2mm 3mm, 4mm, 5mm, 6mm |
Iikhemikhali zomelezwe | DOL≥ 40um CS≥700Mpa | DOL≥ 35um CS≥650Mpa | DOL≥ 35um CS≥650Mpa | DOL≥ 32um CS≥600Mpa | DOL≥ 35um CS≥650Mpa | DOL≥ 8um CS≥450Mpa |
Ukuqina | ≥9H | ≥9H | ≥7H | ≥7H | ≥7H | ≥7H |
Ugqithiso | >92% | >90% | >90% | >90% | >90% | >89% |